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Thicknet Reports
 
Demystifying IT Network Cabling Specifications from 5e to 7A
sponsored by Siemon Company
WHITE PAPER: This paper discusses the current state of copper-based network cabling standards as defined by ISO and TIA. Learn the difference between category 5e, 6, 6A, 7 and 7A and Class D, E, EA, F and FA.
Posted: 20 Aug 2007 | Published: 01 Aug 2007

Siemon Company

When Cloud-Based UC Makes Sense
sponsored by Dimension Data
EGUIDE: This expert E-Guide highlights the evolution of cloud-based UC, the key advantages and what you can expect for the near future. Read on to learn more.
Posted: 21 Nov 2014 | Published: 21 Nov 2014

Dimension Data

Embracing Virtualization, Cloud, and ITaaS with All-Flash
sponsored by HP India
WHITE PAPER: Access this whitepaper to learn more about the advantages of all-flash, including how it can reduce storage management time and enable more transactions per second on fewer disks.
Posted: 22 Jan 2015 | Published: 15 Oct 2014

HP India

Software-Defined Storage — Enabling the Next-Generation Enterprise IT Infrastructure
sponsored by Dell, Inc.
WHITE PAPER: This white paper highlights an SDS platform that provides end-to-end solutions that fully meet performance, availability, support, and scalability needs.
Posted: 09 Oct 2014 | Published: 30 Sep 2014

Dell, Inc.

Seven principles for achieving high performance and scalability for information integration
sponsored by IBM
WHITE PAPER: Read this white paper for information integration success stories. Also, find critical success criteria for an architecture's scalability.
Posted: 26 Jan 2015 | Published: 30 Apr 2014

IBM

The Dell PowerEdge T630 Server Reduces Latency and Offers Improved Performance.
sponsored by Dell, Inc.
WHITE PAPER: View this white paper to learn how one new tower server reduces latency up to 97.9% compared to legacy servers. Read on to discover how choosing a new tower server provides your organization faster processing.
Posted: 22 Oct 2014 | Published: 30 Sep 2014

Dell, Inc.

MarketScope for Unified Communications for the SMB Market, North America
sponsored by Cisco Systems, Inc.
WHITE PAPER: This exclusive resource examines the current state of the UC market for SMBs, detailing which providers can give your organization the tools and solutions you need to thrive in today's business environment.
Posted: 26 Jun 2014 | Published: 26 Jun 2014

Cisco Systems, Inc.

Supporting Mobility with a UC Technology Strategy
sponsored by Windstream Communications
EGUIDE: Learn what standards define mobility, how emerging standards will affect mobile collaboration, and how to evaluate the strength of your unified communications technology strategy.
Posted: 27 Jun 2014 | Published: 27 Jun 2014

Windstream Communications

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

The Building Blocks of Unified Fabric and LAN/SAN Convergence
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This white paper details the benefits of I/O consolidation on Ethernet and Fibre Channel.
Posted: 12 Jun 2014 | Published: 13 Aug 2013

Dell, Inc. and Intel®
 
 
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