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Electronic Devices White Papers (View All Report Types)
 
Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

5 Steps To Accelerate Value From Your Industrial IoT Data
sponsored by SAS
WHITE PAPER: How do you turn your IIoT data into a competitive advantage for your business? Inside, explore 5 steps proven to help you accelerate value from your IIoT data, and discover why should consider SAS Analytics for your IoT needs.
Posted: 12 Aug 2019 | Published: 12 Aug 2019

SAS

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

Bringing Order to IT Chaos in Remote Offices
sponsored by DELL & INTEL
WHITE PAPER: Take a look at this exclusive resource to find out how this converged infrastructure hardware can help you enable business success.
Posted: 18 Feb 2014 | Published: 30 Jun 2013

DELL & INTEL

Best Practices for successful IP Address Management (IPAM)
sponsored by Infoblox
WHITE PAPER: This white paper discusses several ways to develop a successful IPAM strategy.
Posted: 09 Jun 2014 | Published: 09 Jun 2014

Infoblox

HP's latest management solution will help conquer data center challenges
sponsored by HPE and IntelĀ®
WHITE PAPER: Take a look at this exclusive resource to find out how HP's new approach to infrastructure management can help you save time and money when confronting data center challenges.
Posted: 05 Feb 2014 | Published: 31 Oct 2013

HPE and IntelĀ®
 

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