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Microprocessor Architectures

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Computer Weekly Special Report: Fujitsu
sponsored by ComputerWeekly.com
ESSENTIAL GUIDE: This 11 page special report updated for 2014 gives you the facts on  Fujitsu its strategy, products and services and financial performance.
Posted: 04 Feb 2014 | Published: 04 Feb 2014

ComputerWeekly.com

E-Book: Virtualizing Your Infrastructure - Selecting Server Hardware for Virtualization
sponsored by SearchDataCenter.com
EBOOK: Choosing the right server hardware to maximize virtualization benefits is an important investment. To gain the high consolidation ratios you're after, you need powerful-enough hardware to support your workloads and applications. In this expert ebook, explore the hardware consideration to keep in mind as you virtualize.
Posted: 23 Feb 2012 | Published: 23 Feb 2012

SearchDataCenter.com

Maximizing IT Value by Using High-End Server Processors
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Intel IT has standardized on Intel® Xeon® processors with a core frequency of 3 GHz for two-socket servers for design computing and enterprise server virtualization.
Posted: 24 Oct 2008 | Published: 23 Oct 2008

Dell, Inc. and Intel®

IBM WebSphere Extended Deployment Compute Grid
sponsored by IBM
PRODUCT OVERVIEW: WebSphere Extended Deployment Compute Grid provides a multi-functional and multi-platform Java Batch solution that improves operational efficiency of business transaction processing. With support for batch jobs alongside online transactions, WebSphere Extended Deployment Compute Grid delivers a near real-time user experience while optimizing costs.
Posted: 20 Dec 2011 | Published: 20 Dec 2011

IBM

Performance Advantage of Dell PowerEdge R900 over HP DL585 Running Microsoft Hyper-V
sponsored by Dell and Microsoft
WHITE PAPER: The combination of high performance and efficiency make the PowerEdge R900 an excellent Microsoft Hyper-V virtualization server.
Posted: 11 Dec 2008 | Published: 11 Dec 2008

Dell and Microsoft

Open Source at Intel: Building with the Ecosystem
sponsored by Intel
WHITE PAPER: To enable a broad spectrum of software environments and programs to run best on Intel processors and platforms, Intel offers deep technical expertise, makes significant contributions, and actively participates in standards bodies. Read on to learn more.
Posted: 29 Oct 2010 | Published: 26 Mar 2010

Intel

Reducing TCO for Web-Based Applications
sponsored by Hewlett Packard Company and Intel
WHITE PAPER: Servers based on the Intel® Xeon® processor 5500 series deliver both intelligent performance and energy efficiency. Migrating to this platform can enable server consolidation in the deployment of database-driven Web applications, resulting in operational cost savings that far exceed the cost of server refresh. Read on to learn more.
Posted: 08 Jul 2009 | Published: 08 Jul 2009

Hewlett Packard Company and Intel

High Performance for Integrating Massive Data Volumes with Talend Integration Suite MP
sponsored by Talend
WHITE PAPER: Processing very large data sets provides unique constraints, especially when time windows available for this processing are shrinking. This paper presents a variety of technologies available to accelerate the processing of large data volumes, including massive parallelization, optimized data-set-mode processing, grid deployment, and load balancing.
Posted: 16 Mar 2010 | Published: 16 Mar 2010

Talend

Dual-Core Intel® Itanium® 2 Processor 9000 Series
sponsored by Intel and Microsoft
WHITE PAPER: Learn how the Dual-Core Intel® Itanium® 2 processor 9000 from the Dual-core Intel® Itanium® 2 Processor 9000 Series can deliver new levels of performance, flexibility and value for your data-intensive business and te...
Posted: 10 Jul 2007 | Published: 01 Jan 2006

Intel and Microsoft

Introduction to Intel® Core™ Duo Processor Architecture
sponsored by Intel Corporation
PRODUCT OVERVIEW: The Intel® Core™ Duo processor is the first Intel® mobile microarchitecture that uses CMP technology, it was built to achieve high performance, while consuming low power and fitting into different thermal envelopes.
Posted: 24 Jul 2008 | Published: 15 May 2006

Intel Corporation
 
 
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