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Diacs White Papers (View All Report Types)
 
Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

Enterprise Solution Design for SAP HANA
sponsored by HP & Intel®
WHITE PAPER: In this resource, explore the three principles of great enterprise design—stability, scalability, and agility—and learn how to apply them to your SAP landscape with a focus on SAP HANA. Read on for best practices and key design considerations for implementing your SAP HANA enterprise-level solution.
Posted: 25 Sep 2013 | Published: 28 Feb 2013

HP & Intel®

Dell PowerEdge C8000 Series: Flexible, Powerful, and Efficient
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Check out this brief resource to learn about the Dell PowerEdge C8000 – the only shared infrastructure which enables organizations to easily reconfigure, refresh and scale out as needed.
Posted: 19 Feb 2014 | Published: 19 Feb 2014

Dell, Inc. and Intel®

The State of the i
sponsored by Connectria
WHITE PAPER: Access this white paper to learn about the developments of IBM i on Power Systems. Discover how to achieve valuable benefits like reliability, simplified installation and administration, continuing hardware innovations and much more.
Posted: 18 May 2012 | Published: 18 May 2012

Connectria

Indonesia Stock Exchange halves its hardware investment cost with a Red Hat Solution
sponsored by Red Hat and Intel
WHITE PAPER: This brief whitepaper explains how the Indonesian Stock Exchange (IDX) was able to half its hardware costs by leveraging a Linux system to support trading machines, surveillance machines, database engines, and more.
Posted: 16 Dec 2013 | Published: 16 Dec 2013

Red Hat and Intel
 

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