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Flash and Other Emerging Memory Technology Trends

Cover

All the 3D NAND manufacturers are continuing to increase the number of vertical 3D NAND gates with their own technology innovations such as HAR 1-stack VC, BiCS, CuA, and PUC. Many innovative changes and challenges are there on process integration, design architecture and cell operation.

For the emerging memory (EM) including STT-MRAM, XPoint, PCRAM and ReRAM (CBRAM), many of the memory players and foundries are eager to develop EM for higher speed, low power, and almost unlimited retention/endurance operation.

A recent emerging memory technology details and products from major players will be updated and discussed.

Vendor:
Flash Memory Summit
Posted:
Mar 15, 2021
Published:
Dec 16, 2020
Format:
PDF
Type:
Presentation

This resource is no longer available.