All the 3D NAND manufacturers are continuing to increase the number of vertical 3D NAND gates with their own technology innovations such as HAR 1-stack VC, BiCS, CuA, and PUC. Many innovative changes and challenges are there on process integration, design architecture and cell operation.

For the emerging memory (EM) including STT-MRAM, XPoint, PCRAM and ReRAM (CBRAM), many of the memory players and foundries are eager to develop EM for higher speed, low power, and almost unlimited retention/endurance operation.

A recent emerging memory technology details and products from major players will be updated and discussed.

Vendor:

Flash Memory Summit

Posted:

Mar 15, 2021

Published:

Dec 16, 2020

Format:

PDF

Type:

Presentation