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Packaging (of Electronic Components)

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Packaging (of Electronic Components) Reports
FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Virtualization: Optimized Power, Cooling, and Management Maximizes Benefits
sponsored by Schneider Electric
WHITE PAPER: The following white paper explores how to handle the fluctuating power and cooling demands of data center virtualization. Inside, discover methods and possible solutions for dealing with these important issues
Posted: 11 Aug 2015 | Published: 11 Aug 2015

Schneider Electric

Energy Efficient Cooling: IT Handbook
sponsored by Schneider Electric
EBOOK: In this e-book, you'll learn about setting up a cooling monitoring system, optimizing data center cooling efficiency, using hot aisle/ cold aisle containment systems, and economizer selection and implementation.
Posted: 03 May 2010 | Published: 30 Apr 2010

Schneider Electric

Presentation Transcript: High-Speed, Power-Efficient Deduplication: Saving Costs Without Sacrificing Performance
sponsored by FalconStor Software
PRESENTATION TRANSCRIPT: Nexsan and FalconStor have formed a strategic venture to deliver an integrated system designed to optimize almost any backup environment and deliver immediate ROI. Read this presentation transcript to find out how you can minimize reliance on tape, reduce storage consumption and improve operational efficiency.
Posted: 22 Sep 2009 | Published: 01 Sep 2009

FalconStor Software

Hot Aisle vs. Cold Aisle Containment
sponsored by Schneider Electric
WHITE PAPER: This paper examines hot and cold air containment and highlights the reasons why hot aisle containment emerges as the preferred best practice.
Posted: 01 Oct 2010 | Published: 01 Oct 2010

Schneider Electric

Five Major Power Distribution Considerations for Data Center Racks
sponsored by Avocent
WHITE PAPER: Power densities and power consumption costs in data centers are rising. Learn what to consider when choosing the appropriate power distribution products at the rack level.
Posted: 11 Feb 2008 | Published: 01 Feb 2008


Presentation Transcript - Improving Data Center Relations: IT Versus Facilities
sponsored by Viridity Software
PRESENTATION TRANSCRIPT: Today, IT resources can be provisioned quickly and cheaply—some would say too quickly and cheaply. But those IT resources rely on brick and mortar as well as megawatts, which are abstracted from the IT department. This Webcast will identify pitfalls data center teams should avoid.
Posted: 18 Nov 2010 | Published: 18 Nov 2010

Viridity Software

Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by Schneider Electric
WHITE PAPER: This paper discusses new piping approaches, which can dramatically reduce the risk of leakage and facilitate high-density deployment.
Posted: 21 Nov 2008 | Published: 20 Nov 2008

Schneider Electric

Expert guide to using blades for virtualization
sponsored by Hewlett Packard Company and Intel
EGUIDE: In this expert e-guide from SearchServerVirtualization.com, learn the advantages of using blades for server virtualization. Find out when it makes the most sense and what considerations to evaluate when creating a blade virtualization strategy.
Posted: 14 Jul 2010 | Published: 14 Jul 2010

Hewlett Packard Company and Intel

Emerson Network Power Rack PDU Solutions: Rack Power Distribution for Critical IT Equipment
sponsored by Emerson Network Power
WHITE PAPER: Today's successful businesses depend on adaptable technologies to help them respond quickly to market demands. Emerson Network Power's portfolio of products provide innovative, flexible solutions that ensure reliability and efficiency.
Posted: 22 Jan 2010 | Published: 22 Jan 2010

Emerson Network Power
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