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Packaging (of Electronic Components)

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Packaging (of Electronic Components) Reports
 
FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Creating Order from Chaos in Data Centers and Server Rooms
sponsored by Schneider Electric
WHITE PAPER: Data center professionals can rid themselves of messy racks, sub-standard under floor air distribution, and cable sprawl with a minimum of heartache and expense. This paper outlines several innovative approaches for dealing with the symptoms of chaos and for eliminating the root causes of disorder.
Posted: 04 Feb 2009 | Published: 03 Feb 2009

Schneider Electric

Operations Energy Management: From Data Center through Facilities
sponsored by CA Technologies.
WHITE PAPER: Rising energy costs are driving IT and facilities managers alike in all types of organizations to come up with new and innovative ways to reduce the amount of energy used to power and cool the data center.
Posted: 10 Dec 2008 | Published: 13 Oct 2008

CA Technologies.

Improving Rack Cooling Performance Using Airflow Management™ Blanking Panels
sponsored by Schneider Electric
WHITE PAPER: IT equipment mounted in racks cools itself by drawing ambient air from the data center or network room. If the heated exhaust air is allowed to return to the air inlet of the equipment, an undesirable overheating condition may occur. This paper explains how this problem compromises the cooling process and the benefit of using air blanking panels.
Posted: 29 Apr 2009 | Published: 20 Nov 2008

Schneider Electric

Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by Schneider Electric
WHITE PAPER: This paper discusses new piping approaches, which can dramatically reduce the risk of leakage and facilitate high-density deployment.
Posted: 21 Nov 2008 | Published: 20 Nov 2008

Schneider Electric

The Ideal Blade Solution to Replace Your Rack Server: IBM BladeCenter JS12 Express Blade
sponsored by IBM
PRODUCT LITERATURE: Read this article to learn how to simplify your traditional UNIX, IBM i and Linux rack-mount and tower setup with the IBM BladeCenter JS12 Express blade and BladeCenter S chassis. Discover how it delivers a complete integrated business system.
Posted: 11 Sep 2008 | Published: 11 Sep 2008

IBM

Expert guide to using blades for virtualization
sponsored by Hewlett Packard Company and Intel
EGUIDE: In this expert e-guide from SearchServerVirtualization.com, learn the advantages of using blades for server virtualization. Find out when it makes the most sense and what considerations to evaluate when creating a blade virtualization strategy.
Posted: 14 Jul 2010 | Published: 14 Jul 2010

Hewlett Packard Company and Intel

Presentation Transcript - Improving Data Center Relations: IT Versus Facilities
sponsored by Viridity Software
PRESENTATION TRANSCRIPT: Today, IT resources can be provisioned quickly and cheaply—some would say too quickly and cheaply. But those IT resources rely on brick and mortar as well as megawatts, which are abstracted from the IT department. This Webcast will identify pitfalls data center teams should avoid.
Posted: 18 Nov 2010 | Published: 18 Nov 2010

Viridity Software

Five Major Power Distribution Considerations for Data Center Racks
sponsored by Avocent
WHITE PAPER: Power densities and power consumption costs in data centers are rising. Learn what to consider when choosing the appropriate power distribution products at the rack level.
Posted: 11 Feb 2008 | Published: 01 Feb 2008

Avocent

PowerEdge C8000 Chassis
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This brief resource introduces the PowerEdge C8000 4U shared infrastructure chassis that can easily handle multiple workloads to help reduce response times while easing serviceability. Read on to learn more today.
Posted: 23 Jan 2014 | Published: 23 Jan 2014

Dell, Inc. and Intel®
 

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