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Packaging (of Electronic Components)

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Packaging (of Electronic Components)Reports
 
FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Podcast: Network Visibility: Thinking Outside the Box
sponsored by Ixia
PODCAST: This podcast explores the evolution of the data center and the impact that virtualization has had. Listen now to learn how to address the evolving components of modern data centers.
Posted: 24 Jun 2013 | Premiered: Jun 24, 2013

Ixia

Standardization and Modularity in Network-Critical Physical Infrastructure
sponsored by APC by Schneider Electric
WHITE PAPER: Standardization and its close relative, modularity, create wide-ranging benefits in NCPI that streamline and simplify every process from initial planning to daily operation.
Posted: 04 Feb 2009 | Published: 04 Feb 2009

APC by Schneider Electric

Driving Efficiency Within your Data Center: Reduce costs by reducing duplicate data
sponsored by EMC Backup and Recovery Solutions
PRESENTATION TRANSCRIPT: This presentation transcript features Brian Babineau, senior analyst with the Enterprise Strategy Group. Today Badineau would like to talk to you a little bit about driving efficiency within your data center and how you can reduce cost by reducing the amount of duplicate data that maybe in your environment.
Posted: 09 Jul 2009 | Published: 01 Jul 2009

EMC Backup and Recovery Solutions

Choosing System Architecture and Cooling Fluid for High Heat Density Cooling Solutions
sponsored by Emerson Network Power
WHITE PAPER: High heat in critical spaces compromises availability. This paper discusses the pros and cons of different cooling fluids and system architectures, and explores the role of supplemental cooling technologies as data center densities increase.
Posted: 07 Jul 2009 | Published: 07 Jul 2009

Emerson Network Power

Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by APC by Schneider Electric
WHITE PAPER: This paper discusses new piping approaches, which can dramatically reduce the risk of leakage and facilitate high-density deployment.
Posted: 21 Nov 2008 | Published: 20 Nov 2008

APC by Schneider Electric

Automated Energy Efficiency for the Intelligent Business
sponsored by Intel Corporation
IT BRIEFING: By replacing aging single-core processor-based servers with new, more energy-efficient servers, you can gain capacity to grow and to increase IT performance using fewer servers. The estimated cost savings from energy and other operating cost efficiencies can pay for new servers in a an estimated 8 months.
Posted: 20 Apr 2009 | Published: 20 Apr 2009

Intel Corporation

Emerson Network Power Rack PDU Solutions: Rack Power Distribution for Critical IT Equipment
sponsored by Emerson Network Power
WHITE PAPER: Today's successful businesses depend on adaptable technologies to help them respond quickly to market demands. Emerson Network Power's portfolio of products provide innovative, flexible solutions that ensure reliability and efficiency.
Posted: 22 Jan 2010 | Published: 22 Jan 2010

Emerson Network Power

Rack Powering Options for High Density
sponsored by APC by Schneider Electric
WHITE PAPER: In this APC whitepaper, alternatives for providing electrical power to high density racks in data centers and network rooms are explained and compared as well as defined guidelines for rack power systems that can reliably deliver power to high density loads while adapting to changing needs.
Posted: 01 Apr 2010 | Published: 09 Jul 2009

APC by Schneider Electric

Expert guide to using blades for virtualization
sponsored by Hewlett Packard Company and Intel
EGUIDE: In this expert e-guide from SearchServerVirtualization.com, learn the advantages of using blades for server virtualization. Find out when it makes the most sense and what considerations to evaluate when creating a blade virtualization strategy.
Posted: 14 Jul 2010 | Published: 14 Jul 2010

Hewlett Packard Company and Intel
 
 
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