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Packaging (of Electronic Components)

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Packaging (of Electronic Components) Reports
 
FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Energy Efficient Cooling: IT Handbook
sponsored by Schneider Electric
EBOOK: In this e-book, you'll learn about setting up a cooling monitoring system, optimizing data center cooling efficiency, using hot aisle/ cold aisle containment systems, and economizer selection and implementation.
Posted: 03 May 2010 | Published: 30 Apr 2010

Schneider Electric

IBM BladeCenter S - Big Benefits for the Small Office
sponsored by IBM
DATA SHEET: The all-in-one configuration of the IBM BladeCenter S makes it a perfect fit in a small office. It integrates servers, storage, networking and I/O into a single chassis, which uses a standard electrical outlet...
Posted: 10 Jun 2008 | Published: 01 Jun 2008

IBM

PowerEdge C8000 Chassis
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This brief resource introduces the PowerEdge C8000 4U shared infrastructure chassis that can easily handle multiple workloads to help reduce response times while easing serviceability. Read on to learn more today.
Posted: 23 Jan 2014 | Published: 23 Jan 2014

Dell, Inc. and Intel®

Transcript: Network Visibility: Thinking Outside the Box
sponsored by Ixia
PRESENTATION TRANSCRIPT: Explore how virtualization can challenge network monitoring, and discover a scalable solution that will help improve visibility for effective, scalable, secure network monitoring.
Posted: 03 Mar 2014 | Published: 03 Mar 2014

Ixia

Operations Energy Management: From Data Center through Facilities
sponsored by CA Technologies.
WHITE PAPER: Rising energy costs are driving IT and facilities managers alike in all types of organizations to come up with new and innovative ways to reduce the amount of energy used to power and cool the data center.
Posted: 10 Dec 2008 | Published: 13 Oct 2008

CA Technologies.

Increasing Data Center Efficiency by Using Improved High Density Power Distribution
sponsored by Schneider Electric
WHITE PAPER: A new approach to power distribution for high density server installations saves floor space, simplifies power cabling, saves capital cost, reduces weight, and increases electrical efficiency. This paper describes this distribution architecture and quantifies the benefits.
Posted: 29 Apr 2009 | Published: 01 Jan 2006

Schneider Electric

Rack Powering Options for High Density
sponsored by Schneider Electric
WHITE PAPER: In this APC whitepaper, alternatives for providing electrical power to high density racks in data centers and network rooms are explained and compared as well as defined guidelines for rack power systems that can reliably deliver power to high density loads while adapting to changing needs.
Posted: 01 Apr 2010 | Published: 09 Jul 2009

Schneider Electric

Automated Energy Efficiency for the Intelligent Business
sponsored by Intel Corporation
IT BRIEFING: By replacing aging single-core processor-based servers with new, more energy-efficient servers, you can gain capacity to grow and to increase IT performance using fewer servers. The estimated cost savings from energy and other operating cost efficiencies can pay for new servers in a an estimated 8 months.
Posted: 20 Apr 2009 | Published: 20 Apr 2009

Intel Corporation

Top 5 Questions to Ask About Your 10GbE Data Center
sponsored by Juniper Networks, Inc.
WHITE PAPER: Before making the jump to a 10 Gigabit Ethernet data center network, there are five questions you should ask yourself. View this whitepaper to learn what they are!
Posted: 17 Apr 2013 | Published: 28 Sep 2012

Juniper Networks, Inc.
 
 
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