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Packaging (of Electronic Components)

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Packaging (of Electronic Components)Reports
 
FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Failover Strategies on the Cisco UCS B Series Chassis
sponsored by Global Knowledge
WHITE PAPER: This white paper discusses how Cisco's popular and powerful Unified Computing Solution is driven by the flexibility and agility of the hardware failover options and Service Profiles.
Posted: 29 Sep 2014 | Published: 29 Sep 2014

Global Knowledge

Collaboration Tools for Today's On-the-Go Workforce
sponsored by CISCO & INTEL®
EBRIEF: Check out this resource to discover the Cisco Unified Computing System C-Series Rack Servers and B-Series Blade Servers that run Microsoft Exchange server to provide a solid foundation for corporate messaging solutions.
Posted: 15 Apr 2013 | Published: 31 Dec 2012

CISCO & INTEL®

Improving Rack Cooling Performance Using Airflow Management™ Blanking Panels
sponsored by APC by Schneider Electric
WHITE PAPER: IT equipment mounted in racks cools itself by drawing ambient air from the data center or network room. If the heated exhaust air is allowed to return to the air inlet of the equipment, an undesirable overheating condition may occur. This paper explains how this problem compromises the cooling process and the benefit of using air blanking panels.
Posted: 29 Apr 2009 | Published: 20 Nov 2008

APC by Schneider Electric

Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by APC by Schneider Electric
WHITE PAPER: This paper discusses new piping approaches, which can dramatically reduce the risk of leakage and facilitate high-density deployment.
Posted: 21 Nov 2008 | Published: 20 Nov 2008

APC by Schneider Electric

Liebert® CRV™ Row-Based Cooling: Intelligent Precision Cooling for Data Center Equipment
sponsored by Emerson Network Power
BROCHURE: In 2002, Emerson Network Power's Liebert XD family was the industry's first row-based cooling system. Now, we have taken more than 40 years of engineering experience and the most advanced technologies to design the Liebert CRV row-based precision cooling system. Learn the flexibility, TCO and availability benefits of their latest cooling solution.
Posted: 22 Jan 2010 | Published: 22 Jan 2010

Emerson Network Power

Presentation Transcript - Improving Data Center Relations: IT Versus Facilities
sponsored by Viridity Software
PRESENTATION TRANSCRIPT: Today, IT resources can be provisioned quickly and cheaply—some would say too quickly and cheaply. But those IT resources rely on brick and mortar as well as megawatts, which are abstracted from the IT department. This Webcast will identify pitfalls data center teams should avoid.
Posted: 18 Nov 2010 | Published: 18 Nov 2010

Viridity Software

IBM BladeCenter S - Big Benefits for the Small Office
sponsored by IBM
DATA SHEET: The all-in-one configuration of the IBM BladeCenter S makes it a perfect fit in a small office. It integrates servers, storage, networking and I/O into a single chassis, which uses a standard electrical outlet...
Posted: 10 Jun 2008 | Published: 01 Jun 2008

IBM

Emerson Network Power Rack PDU Solutions: Rack Power Distribution for Critical IT Equipment
sponsored by Emerson Network Power
WHITE PAPER: Today's successful businesses depend on adaptable technologies to help them respond quickly to market demands. Emerson Network Power's portfolio of products provide innovative, flexible solutions that ensure reliability and efficiency.
Posted: 22 Jan 2010 | Published: 22 Jan 2010

Emerson Network Power

PowerEdge C8000 Chassis
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This brief resource introduces the PowerEdge C8000 4U shared infrastructure chassis that can easily handle multiple workloads to help reduce response times while easing serviceability. Read on to learn more today.
Posted: 23 Jan 2014 | Published: 23 Jan 2014

Dell, Inc. and Intel®
 
 
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