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Packaging (of Electronic Components)

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Packaging (of Electronic Components)Reports
 
FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Podcast: Network Visibility: Thinking Outside the Box
sponsored by Ixia
PODCAST: This podcast explores the evolution of the data center and the impact that virtualization has had. Listen now to learn how to address the evolving components of modern data centers.
Posted: 24 Jun 2013 | Premiered: Jun 24, 2013

Ixia

Transcript: Network Visibility: Thinking Outside the Box
sponsored by Ixia
PRESENTATION TRANSCRIPT: Explore how virtualization can challenge network monitoring, and discover a scalable solution that will help improve visibility for effective, scalable, secure network monitoring.
Posted: 03 Mar 2014 | Published: 03 Mar 2014

Ixia

Enhanced Messaging & Collaboration for Businesses of All Sizes
sponsored by Cisco Unified Computing System with Intel® Xeon® processor
EBRIEF: Check out this resource to discover the Cisco Unified Computing System C-Series Rack Servers and B-Series Blade Servers that run Microsoft Exchange server to provide a solid foundation for corporate messaging solutions.
Posted: 15 Apr 2013 | Published: 31 Dec 2012

Cisco Unified Computing System with Intel® Xeon® processor

Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by APC by Schneider Electric
WHITE PAPER: This paper discusses new piping approaches, which can dramatically reduce the risk of leakage and facilitate high-density deployment.
Posted: 21 Nov 2008 | Published: 20 Nov 2008

APC by Schneider Electric

BladeCenter HS 12 and JS 12 Video
sponsored by IBM
VIDEOCAST: Find out how the IBM BladeCenter HS12 and JS12 deliver availability, scalability and redundancy by watching this video.
Posted: 11 Sep 2008 | Premiered: Sep 11, 2008

IBM

Liebert® CRV™ Row-Based Cooling: Intelligent Precision Cooling for Data Center Equipment
sponsored by Emerson Network Power
BROCHURE: In 2002, Emerson Network Power's Liebert XD family was the industry's first row-based cooling system. Now, we have taken more than 40 years of engineering experience and the most advanced technologies to design the Liebert CRV row-based precision cooling system. Learn the flexibility, TCO and availability benefits of their latest cooling solution.
Posted: 22 Jan 2010 | Published: 22 Jan 2010

Emerson Network Power

Automated Energy Efficiency for the Intelligent Business
sponsored by Intel Corporation
IT BRIEFING: By replacing aging single-core processor-based servers with new, more energy-efficient servers, you can gain capacity to grow and to increase IT performance using fewer servers. The estimated cost savings from energy and other operating cost efficiencies can pay for new servers in a an estimated 8 months.
Posted: 20 Apr 2009 | Published: 20 Apr 2009

Intel Corporation

Choosing System Architecture and Cooling Fluid for High Heat Density Cooling Solutions
sponsored by Emerson Network Power
WHITE PAPER: High heat in critical spaces compromises availability. This paper discusses the pros and cons of different cooling fluids and system architectures, and explores the role of supplemental cooling technologies as data center densities increase.
Posted: 07 Jul 2009 | Published: 07 Jul 2009

Emerson Network Power

What storage and network convergence really means - Europe
sponsored by SearchNetworking.com
EZINE: This issue will investigate how users are addressing convergence in the field, and what their outlook is for the future.
Posted: 01 Apr 2011 | Published: 01 Apr 2011

SearchNetworking.com
 
 
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