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Heat Sinks

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DEFINITION: A material that absorbs heat. It is typically made of aluminum. Heat sinks are commonly used in amplifiers and other electronic devices that build up heat, and it is the most economical method for cooling a semiconductor device (chip).
Heat SinksReports
201 - 225 of 395 Matches Previous Page  | Next Page
IBM System x3650 M4 Servers Data Sheet
sponsored by IBM and Intel.
WHITE PAPER: Explore this datasheet to learn about a scalable server package that can save your enterprise money without sacrificing speed or availability.
Posted: 07 Jul 2014 | Published: 14 Sep 2013

IBM and Intel.

IDC: Enterprise Workloads on The IBM X6 Portfolio: Driving Business Advantages
sponsored by IBM
WHITE PAPER: Check out this exclusive white paper to find out how IBM's new systems meet business critical demands with virtualization, business analytics and ERP applications.
Posted: 05 Mar 2014 | Published: 31 Jan 2014

IBM

Implementing Global E-Invoicing with Guaranteed Legal Certainty
sponsored by OpenText GXS
WHITE PAPER: This white paper explains the role local tax compliance plays in successful supply chain management and e-business initiatives, and how leading global brands and governments are addressing this need.
Posted: 30 May 2014 | Published: 11 Aug 2014

OpenText GXS

Improve Performance and Increase Value With A PC Refresh
sponsored by Dell, Inc. and Windows 8 Pro
WHITE PAPER: This white paper reveals three reasons to upgrade to new client systems in order to improve performance.
Posted: 08 Sep 2014 | Published: 29 Aug 2014

Dell, Inc. and Windows 8 Pro

Integrated OpenStack Cloud Solution with Service Assurance
sponsored by Intel
WHITE PAPER: Find out which hardware and software solutions can enable the private cloud to run all workloads.
Posted: 18 Aug 2014 | Published: 18 Aug 2014

Intel

IBM System X4: Delivering High Value through Scale Up
sponsored by IBM
WHITE PAPER: This IDC white paper explores the benefits of consolidation and virtualization, it shows how utilizing larger servers with scale-up architectures is a more cost effective approach to growing business needs.
Posted: 10 Jun 2008 | Published: 01 Jan 2008

IBM

IDC: Next - Generation Power and Cooling for Blade Environments
sponsored by Hewlett Packard Company and Intel
ANALYST REPORT: In this technical brief, IDC examines HP Thermal Logic, a holistic approach to improving power and cooling efficiency in the IT infrastructure, designed to help companies reduce energy consumption, reclaim unused datacenter capacity, and extend the life of their datacenter.
Posted: 06 Apr 2009 | Published: 01 Dec 2008

Hewlett Packard Company and Intel

Identifying and Fixing Data Center Hot Spots
sponsored by APC by Schneider Electric
WEBCAST: Hot spots can seriously reduce the efficiency of an organization's computer equipment. Watch this webcast for expert tips on remediating your data center's hot spots and discover the costs associated with the task.
Posted: 21 Aug 2009 | Premiered: Aug 21, 2009

APC by Schneider Electric

Imaging a Latitude 10 on Windows 8 with System Center Configuration Manager
sponsored by Dell, Inc.
WHITE PAPER: Check out this exclusive white paper for directions on how to create a Windows 8 image for the Latitude 10, as well as the information you need to image a Latitude 10 in your enterprise environment.
Posted: 07 Mar 2014 | Published: 31 Dec 2010

Dell, Inc.

Impact of High Density Hot Aisles on IT Personnel Work Conditions
sponsored by APC by Schneider Electric
WHITE PAPER: The use of modern enclosed hot aisles to address increasing power densities in the data center has brought into question the suitability of working conditions in these hot aisle environments. In this paper, it is determined that the additional heat stress imposed by such high density IT environments is of minimal concern.
Posted: 26 Jan 2011 | Published: 26 Jan 2011

APC by Schneider Electric

Impact of High Density Hot Aisles on IT Personnel Work Conditions
sponsored by Schneider Electric
WHITE PAPER: This white paper discusses the issue of increasing discomfort for computer room workers in high power density data centers.
Posted: 10 Oct 2013 | Published: 10 Oct 2013

Schneider Electric

Impact of Hot and Cold Aisle Containment on Data Centre Temperature and Efficiency
sponsored by APC by Schneider Electric
WHITE PAPER: Access this exclusive resource to discover the efficiency benefits of containment and learn about the differences between hot-air and cold-air strategies.
Posted: 09 Dec 2011 | Published: 09 Dec 2011

APC by Schneider Electric

Improve Data Center Efficiency with Enterprise Linux Servers
sponsored by SUSE
WHITE PAPER: IT budgets are not expected to recover anytime soon, so companies need to adjust to the reality of using fewer resources to deliver business services. This white paper explains how you can accomplish this seemingly impossible objective by running your critical workloads on Linux.
Posted: 19 Jun 2012 | Published: 01 Mar 2012

SUSE

Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by APC by Schneider Electric
WHITE PAPER: This paper discusses new piping approaches, which can dramatically reduce the risk of leakage and facilitate high-density deployment.
Posted: 21 Nov 2008 | Published: 20 Nov 2008

APC by Schneider Electric

Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by Schneider Electric
WHITE PAPER: This white paper details the issues involved with chilled water piping and offers flexible piping as a reliable solution.
Posted: 10 Oct 2013 | Published: 07 Oct 2011

Schneider Electric

Improving Data Center Infrastructure with Oracle's x86 Systems
sponsored by Oracle Corporation
WHITE PAPER: Learn how your organization can fight the complexity that usually comes with virtualization and cloud computing. This white paper presents a vendor that can offer a complete hardware and software stack for virtualized x86 infrastructures which allows enhanced reliability, optimized performance and cost savings.
Posted: 27 Jun 2012 | Published: 25 Jun 2012

Oracle Corporation

Improving Rack Cooling Performance Using Airflow Management™ Blanking Panels
sponsored by APC by Schneider Electric
WHITE PAPER: IT equipment mounted in racks cools itself by drawing ambient air from the data center or network room. If the heated exhaust air is allowed to return to the air inlet of the equipment, an undesirable overheating condition may occur. This paper explains how this problem compromises the cooling process and the benefit of using air blanking panels.
Posted: 29 Apr 2009 | Published: 20 Nov 2008

APC by Schneider Electric

Improving the mobile experience through solid state drive
sponsored by Intel Corporation
WHITE PAPER: Intel IT is evaluating solid-state drive (SSD) technology to better understand the benefits to users and the impacts on the enterprise. We have initiated a proof of concept (PoC) study that includes extensive benchmark testing as well as deployment of notebooks with SSDs to the Intel workforce.
Posted: 27 May 2009 | Published: 05 Jan 2009

Intel Corporation

Increase security and ROI: The benefits of Intel vPro technology
sponsored by Intel
PRODUCT DEMO: Significantly improve your company’s IT security and ROI with the all new 2010 Intel® Core™ vPro™ processor family.
Posted: 28 Apr 2010 | Premiered: 28 Apr 2010

Intel

Increase Utilization, Decrease Energy Costs With Data Center Virtualization
sponsored by Hewlett-Packard Company
WEBCAST: This webcast explores answers to some of the key questions around getting started with virtualization. It addresses cost savings, weighing benefits vs. risks, transitioning from older platforms to new ones, best practices and more.
Posted: 21 May 2008 | Premiered: Jun 19, 2008, 12:00 EDT (16:00 GMT)

Hewlett-Packard Company

Increasing Business Performance: Using Virtualization for SAP Applications on IBM System p Servers
sponsored by IBM
WHITE PAPER: This white paper captures the experiences of six large companies running SAP applications using IBM® System p™ virtualization.
Posted: 17 Jun 2008 | Published: 16 Jun 2010

IBM

Indonesia Stock Exchange halves its hardware investment cost with a Red Hat Solution
sponsored by Red Hat and Intel
WHITE PAPER: This brief whitepaper explains how the Indonesian Stock Exchange (IDX) was able to half its hardware costs by leveraging a Linux system to support trading machines, surveillance machines, database engines, and more.
Posted: 16 Dec 2013 | Published: 16 Dec 2013

Red Hat and Intel

Information Security Roles and Responsibilities Made Easy
sponsored by Information Shield, Inc.
SOFTWARE LISTING: Reducing the total cost of information security services by properly documented roles and responsibilities.
Posted: 14 Feb 2008 | Published: 01 Jan 2007


Integrated Infrastructure and Performance Management for Virtualized Environments
sponsored by CA Technologies.
WHITE PAPER: Enterprises, government agencies and service providers are increasingly employing virtualized environments to decrease costs, consolidate data center space and reduce environmental impacts. This paper describes a comprehensive set of CA tools for managing virtual environments.
Posted: 29 Apr 2009 | Published: 01 Apr 2009

CA Technologies.

Integrating HP Data Protector Software with HP Data Deduplication Solutions
sponsored by HP
WHITE PAPER: This white paper will discuss HP Data Protector Software which fully supports HP data deduplication technologies allowing you to recover files more quickly while reducing your data management and storage costs.
Posted: 10 Dec 2008 | Published: 10 Dec 2008

HP
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