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Heat Sinks

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DEFINITION: A material that absorbs heat. It is typically made of aluminum. Heat sinks are commonly used in amplifiers and other electronic devices that build up heat, and it is the most economical method for cooling a semiconductor device (chip).
Heat Sinks Reports
176 - 200 of 439 Matches Previous Page  |  Next Page
Group-Based Policy for OpenStack
sponsored by Cisco Systems, Inc.
WHITE PAPER: This white paper introduces the new OpenStack Group-Based Policy (GBP) framework designed to offer a new set of API extensions to manage OpenStack infrastructure through declarative policy abstractions. Find out how GBP is based on four main concepts and explore a broad range of use cases.
Posted: 10 Mar 2015 | Published: 31 Dec 2014

Cisco Systems, Inc.

Guide to fixing a disable computer with a flashing power light
sponsored by Dell, Inc. & Intel®
VIDEO: Access this informative video to see an in-depth demonstration of how to fix the power supply on a desktop computer in order to get it started working again.
Posted: 13 Apr 2015 | Premiered: 23 Oct 2014

Dell, Inc. & Intel®

Hadoop for Cloud ebook
sponsored by IBM
WHITE PAPER: This resource explores how you can use Hadoop in the cloud to cost-effectively deploy analytics for all users in your organization, providing the benefits of big data to everyone. Read on to learn how to reduce hardware and software costs, avoid future expansion costs, and simplify development processes.
Posted: 01 Apr 2015 | Published: 30 Apr 2014

IBM

Hardware Upgrades to Improve Database SharePoint, Exchange, and File Server Performance with the Dell Poweredge T630
sponsored by Dell, Inc. and Intel®
WHITE PAPER: You can have the hardware necessary to ensure your applications meet business workloads of today and those to come in the future with the Dell PowerEdge T630 Tower Server.
Posted: 06 Nov 2014 | Published: 17 Sep 2014

Dell, Inc. and Intel®

How Red Hat Brings OpenStack into the Enterprise
sponsored by Red Hat
PRODUCT OVERVIEW: Explore this exclusive resource to uncover Red Hat's approach to OpenStack, what they've gained from this technology and much more.
Posted: 02 Apr 2014 | Published: 31 Dec 2013

Red Hat

How to Handle the High Demands of Today's Workloads
sponsored by Hewlett-Packard Limited & Intel® (Procesor Intel® Xeon®)
WHITE PAPER: Access this white paper to learn why businesses must take the opportunity to update their hardware in order to meet the demands of today's workloads, as well as gain the significant benefits that a modern IT infrastructure brings.
Posted: 14 Apr 2015 | Published: 31 Jan 2015

Hewlett-Packard Limited & Intel® (Procesor  Intel® Xeon®)

How to Improve IT Service Levels and Control Costs Simultaneously
sponsored by Rackspace
CASE STUDY: Access this case study to find out how SVN developed an on-site/off-shore network to deliver more automation to brokers and reduce costs.
Posted: 14 Nov 2014 | Published: 31 Dec 2008

Rackspace

Go Green with IBM System x Servers and Intel Xeon Processors
sponsored by IBM
PRODUCT LITERATURE: With energy prices on a steep climb, soon the cost to power and cool a server over its life span could equal its purchase price. By “going green” with energy-efficient IBM® System x™ servers featuring Intel® Xeon® processors, you can win back control of your IT budget--and win the battle with data center...
Posted: 19 Feb 2009 | Published: 19 Feb 2009

IBM

Going Green While Reducing Operational Costs
sponsored by IBM
PRESENTATION TRANSCRIPT: Review this document based on an IBM/TechTarget Webcast entitled "Going Green While Reducing Operational Costs" to learn what experienced analyst Joe Clabby has to say about data centers and facilities.
Posted: 16 Jan 2009 | Published: 16 Jan 2009

IBM

Going Parallel with LabVIEW Delivers Throughput Gains
sponsored by National Instruments
WHITE PAPER: In this whitepaper learn how by combining technologies with NI Lab VIEW parallel programming software and NI TestStand test management software, test engineers can create high-performance test systems.
Posted: 16 Sep 2008 | Published: 16 Sep 2008

National Instruments

Green Computing beyond the Data Center - IT Briefing
sponsored by Faronics
WHITE PAPER: Organizations considering green computing initiatives start in the data center but the truth is that in many organizations more power and heat waste is generated outside of the data center. This white paper discusses seven actions that address the prob...
Posted: 28 Sep 2007 | Published: 01 Sep 2007

Faronics

Green Initiatives: Lowering Costs and Increasing Efficiency in the Data Center
sponsored by 3PAR
BOOK: Conserving energy, reducing floor space, and managing utility costs are becoming major priorities for IT organizations. In this study by Aberdeen, over 175 organizations were surveyed about their opinions on Best-in-Class practices for IT organizations.
Posted: 07 May 2008 | Published: 01 Feb 2008

3PAR

Green Networking in the Data Center
sponsored by Hewlett Packard Company and Intel
WHITE PAPER: This paper provides an overview of the challenges faced in today's data centers; addressing the issues surrounding data center power, cooling and efficiency, with an emphasis on how specific networking tools and strategies can help address these issues. It will also highlight the HP ProCurve data center solutions that focus on efficiency.
Posted: 09 Jul 2009 | Published: 01 Jun 2009

Hewlett Packard Company and Intel

Guidance for Calculation of Efficiency (PUE) in Data Centres
sponsored by Schneider Electric
WHITE PAPER: The efficiency ratings of a data centre can vary substantially depending on what methodologies are applied. Access this exclusive resource to discover the importance of measuring data centre efficiency and learn about the issues companies face when establishing the PUE of an infrastructure.
Posted: 09 Dec 2011 | Published: 09 Dec 2011

Schneider Electric

Guidelines for Specification of Data Center Power Density
sponsored by Schneider Electric
WHITE PAPER: Specifying data center density has yet to conform to an established standard within the industry. This paper describes the science and practical application of an improved method for the specification of power and cooling infrastructure for data centers.
Posted: 30 Oct 2006 | Published: 01 Jan 2005

Schneider Electric

High Availability for SQL Server 2005 Using array-based Replication and Host-based Mirroring Technologies
sponsored by Hewlett-Packard Company
WHITE PAPER: This paper provides the data needed to understand the options and the limitations for implementing remote replication solutions on a clustered HP server and storage area network (SAN)-based storage infrastructure.
Posted: 12 Mar 2008 | Published: 01 Jan 2008

Hewlett-Packard Company

High Efficiency Indirect Air Economizer-based Cooling for Data Centers
sponsored by Schneider Electric
WHITE PAPER: This white paper details how indirect air economizer-based cooling will lower the cost of running your data center without the same risk as directly exposing your infrastructure to the outdoor air.
Posted: 18 Nov 2013 | Published: 18 Nov 2013

Schneider Electric

High-performance Two-socket Server Supports a Variety of Business-Critical Workloads
sponsored by IBM and Intel.
DATA SHEET: Read this informative data sheet from IBM detailing their new server hardware optimized for cloud computing and desktop virtualization and learn how their new servers can cut downtime out of the equation for you and your organization.
Posted: 07 Jul 2014 | Published: 30 Sep 2013

IBM and Intel.

Hitachi Data Systems Optimized Workflow Solutions for Oil and Gas Exploration and Production
sponsored by Hitachi Data Systems
DATA SHEET: This white paper showcases a solution that is architected to scale and handle diverse performance requirements and automate the implementation of data retention policies. Discover how this uniquely designed technology combines a data management framework with hardware help in the form of FPGAs that provide robust performance for I/O operations.
Posted: 27 Sep 2013 | Published: 30 Nov 2012

Hitachi Data Systems

Hot Aisle vs. Cold Aisle Containment
sponsored by Schneider Electric
WHITE PAPER: This paper examines hot and cold air containment and highlights the reasons why hot aisle containment emerges as the preferred best practice.
Posted: 01 Oct 2010 | Published: 01 Oct 2010

Schneider Electric

How Monitoring Systems Reduce Human Error in Distributed Server Rooms and Remote Wiring Closets
sponsored by Schneider Electric
WHITE PAPER: Surprise incidences of downtime in server rooms and remote wiring closets lead to sleepless nights for many IT managers. This paper analyzes several of these incidents and makes recommendations for how a basic monitoring system can help reduce the occurrence of these unanticipated events.
Posted: 26 Jan 2011 | Published: 26 Jan 2011

Schneider Electric

How to Adapt to the Dynamics of the Virtual Workforce
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This exclusive paper takes an in-depth look at an integrated solution stack from Dell that enables desktop virtualization, from pilots to full scale deployments, as a complete data center solution.
Posted: 12 Jun 2013 | Published: 12 Jun 2013

Dell, Inc. and Intel®

How to Become an SOA Superhero
sponsored by IBM
BROCHURE: This brochure shows how you can be a superhero by making WebSphere MQ the messaging backbone for your SOA, creating a common connection for the free flow of information.
Posted: 12 Feb 2009 | Published: 11 Feb 2009

IBM

How to Start a Windows Vista Pilot Deployment
sponsored by Microsoft
WHITE PAPER: Thinking about deploying Windows Vista? This guide gives an overview of how to successfully manage a pilot program that provides the best experience for pilot users and helps to provide positive project justification to business decision makers.
Posted: 26 Nov 2008 | Published: 26 Nov 2008

Microsoft

How to Tell When Your Data Center Hardware Needs a Refresh
sponsored by Hewlett-Packard Company and AMD
EGUIDE: Access this eGuide to determine if your data center hardware is ready for a re-fresh and discover cost-effective alternatives to a re-fresh, including leasing and upgrading the existing hardware in your data center for a highly favorable ROI.
Posted: 11 May 2011 | Published: 11 May 2011

Hewlett-Packard Company and AMD
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