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How Can Semiconductor Firms Cut Design Costs and Shorten Time-To-Market?
sponsored by IBM
RESOURCE: This resource explores the effectiveness of a set of electronic design automation (EDA) tools for semiconductor chip designers. Find out how to accelerate the delivery of high-quality processors to the market faster and more cost-effectively.
Posted: 20 Sep 2016 | Published: 20 Sep 2016

IBM

Ensuring Successful Manufacturing Execution in the Fabless Semiconductor Model
sponsored by SAP AG
WHITE PAPER: The number of semiconductor companies adopting a fabless manufacturing model continues to increase. And to thrive in this highly competitive market, the fabless company must produce the best product designs for its intended market. This SAP Executive Insight examines the growing trend toward the fabless manufacturing model.
Posted: 17 Sep 2008 | Published: 17 Sep 2008

SAP AG

Step up Your Game. Global Delivery Capabilities for the Electronics Industry
sponsored by IBM Line of Business
WHITE PAPER: How can your business meet the ever-increasing demands of end users and still make a healthy profit? IBM takes a look at innovation's role in driving business objectives and helping electronics enterprises move forward.
Posted: 17 Jun 2008 | Published: 17 Jun 2008

IBM Line of Business

Webinar: Managing the Deployment Lifecycle
sponsored by RightScale
WEBCAST: In this webinar, RightScale presents typical lifecycle scenarios that you accomplish today in your datacenter – and show how you can execute them on the cloud in a more automated and repeatable manner.
Posted: 01 Mar 2010 | Premiered: Mar 1, 2010

RightScale

How Finance Teams Can Help Their Organizations Get Future-Ready
sponsored by IBM
WHITE PAPER: This white paper explores how finance teams can improve performance management, embrace lean practices, implement a scrum methodology, and more. Access now to find out what the best practices are for making your business future-ready.
Posted: 16 Jun 2016 | Published: 30 Jan 2015

IBM

Rising Above the Competition as a Cloud Services Provider: Five Effective Steps for Claiming Your Share of the Pie
sponsored by CA Technologies.
WHITE PAPER: Learn how you can rise above the competition as a cloud provider, especially by using the five key steps outlined in this resource.
Posted: 06 Apr 2012 | Published: 06 Apr 2012

CA Technologies.

Mobile Devices, Cloud Apps, and the Digital Workplace
sponsored by Hewlett Packard Enterprise
WEBCAST: This webcast explores the impact of mobile devices and cloud apps have on your organization, your network, and the security pros charged with safeguarding it all. There will be a special emphasis on vertical industries such as retail and education, plus a deep dive into healthcare.
Posted: 26 Aug 2016 | Premiered: Aug 19, 2016

Hewlett Packard Enterprise

Managing and Securing Mobile Healthcare Data and Devices
sponsored by Fiberlink Communications
WHITE PAPER: Regulatory compliance tops the list of concerns among healthcare and life sciences IT professionals with 86% of healthcare IT decision-makers rating it as a high or critical priority over the course of the coming year. Check out this paper to find out more!
Posted: 17 Mar 2010 | Published: 17 Mar 2010

Fiberlink Communications

Small Form Factor (SFF) SAS - Meeting the Demanding Requirements in Specific Markets
sponsored by Xtore
WHITE PAPER: SAS technology has been proven to be the most versatile storage solution in data transfer and high performance. Read this white paper to learn about a solution that renders the necessary performance needed for your client's expanding market requirements.
Posted: 22 Aug 2007 | Published: 01 Aug 2007

Xtore

Mobile Devices, Cloud Apps, and the Digital Workplace
sponsored by Hewlett Packard Enterprise
TRANSCRIPT: The digital workplace is shifting from a buzzword to an accepted and widely adopted technology, much like the cloud did a few years ago. In this webinar transcript, experts Brien Posey and Rick Reid explore what the digital workplace is and the role of mobile devices and cloud apps in it.
Posted: 01 Sep 2016 | Published: 01 Sep 2016

Hewlett Packard Enterprise
 
 
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