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Computer Engineering Reports
 
Two-Dimensional Computational Fluid Dynamics Analysis of Blanking Panel Solutions
sponsored by Upsite Technologies, Inc.
WHITE PAPER: This white paper discusses a study showing the effect of blanking (filler) panels on airflow patterns and IT equipment intake temperatures within equipment (server) cabinets.
Posted: 18 Feb 2008 | Published: 01 Feb 2008

Upsite Technologies, Inc.

Output short-circuit current bearable by the UPS
sponsored by Emerson Network Power
WHITE PAPER: The purpose of this white paper is to clarify the concept of prospective short circuit currently bearable by the UPS, to explain the role of fuses as well as indicate the requirements of the international IEC 62040-1 standard.
Posted: 08 Aug 2016 | Published: 01 Jan 2016

Emerson Network Power

Digital Printing: Deliver Speed and Quality Together
sponsored by TechData - HP
WHITE PAPER: Digital printing speed, quality, productivity, and cost – it shouldn't be a tradeoff where you have to sacrifice one for the other. This paper explores how to balance these key traits of printing hardware and apps. Discover how to implement a reliable, scalable printing strategy that delivers quality and speed together without driving up the costs.
Posted: 27 Jan 2017 | Published: 31 Jan 2016

TechData - HP

CW Special Report on Dell
sponsored by ComputerWeekly.com
ESSENTIAL GUIDE: This 11 page special report, independently written by Computer Weekly, gives you the facts on Dell, its strategy in 2013, products and services and financial performance.
Posted: 19 Sep 2013 | Published: 19 Sep 2013

ComputerWeekly.com

Five Major Power Distribution Considerations for Data Center Racks
sponsored by Avocent
WHITE PAPER: Power densities and power consumption costs in data centers are rising. Learn what to consider when choosing the appropriate power distribution products at the rack level.
Posted: 11 Feb 2008 | Published: 01 Feb 2008

Avocent

Data Center Servers and Storage E-Book Chapter 1: Selecting a Server for Virtualization
sponsored by Dell, Inc. and Intel®
EBOOK: Selecting a new server is always a crucial call, but virtualization adds some wrinkles that administrators must be aware of. This first chapter outlines the selection criteria with special emphasis on hardware attributes that demand serious consideration in a virtual environment.
Posted: 09 Mar 2010 | Published: 09 Mar 2010

Dell, Inc. and Intel®

Software and Services Financing
sponsored by IBM
WHITE PAPER: Financing information technology hardware is an accepted way of doing business. Clients are discovering the benefits of financing software and services and are making financing of software and services one of the fastest-growing segments of the IT financing industry. This paper explains the importance of aligning financing with IT transformation.
Posted: 18 Feb 2009 | Published: 18 Feb 2009

IBM

How Can Semiconductor Firms Cut Design Costs and Shorten Time-To-Market?
sponsored by IBM
RESOURCE: This resource explores the effectiveness of a set of electronic design automation (EDA) tools for semiconductor chip designers. Find out how to accelerate the delivery of high-quality processors to the market faster and more cost-effectively.
Posted: 20 Sep 2016 | Published: 20 Sep 2016

IBM

How to Certify or Re-certify Twisted-Pair Cabling for 10 Gb/s Ethernet
sponsored by Fluke Networks
WHITE PAPER: This paper provides a background and an overview of the performance requirements for the twisted-pair cabling and methods to measure and certify the performance of the installed cabling system.
Posted: 09 Jun 2008 | Published: 01 Apr 2008

Fluke Networks

Business Ready Solutions for Virtual Infrastructure Availability Using Dell™ PowerEdge™ Servers, Dell Powervault™ Storage, and VMware vSphere™
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This white paper presents an example configuration and best practices for deploying and configuring a highly available architecture using an example solution configuration and then discussing how the configuration helps in maximizing uptime.
Posted: 24 Nov 2009 | Published: 24 Jul 2009

Dell, Inc. and Intel®
 
 
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