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Symmetric Multiprocessing White Papers (View All Report Types)
 
Infrastructure Matters: POWER8 vs. Xeon x86
sponsored by IBM
WHITE PAPER: Examine in this paper the key differences between two processing architectures: POWER8 vs Xeon x86. Read on to discover if this new generation of POWER8 processor-based servers are more efficient than x86 based systems and deliver faster computing results.
Posted: 26 Aug 2016 | Published: 31 Dec 2014

IBM

Intelligence that Adapts to Your Needs
sponsored by Intel
WHITE PAPER: The all new 2010 Intel Core vPro processor family is designed to keep downtime and desk-side visits to a minimum.
Posted: 28 Apr 2010 | Published: 28 Apr 2010

Intel

The All New 2010 Intel Core vPro Processor Family and Windows 7: Your Best Choice for Business PCs
sponsored by Intel
WHITE PAPER: The all new Intel® Core™ vPro™ processor family complements the new Windows® 7 operating system by building effective trusted computing and management mechanisms into the hardware. Read this paper to learn more.
Posted: 04 Oct 2010 | Published: 25 Jan 2010

Intel

Oracle Unbreakable Linux: An Overview
sponsored by Oracle Corporation
WHITE PAPER: This white paper reviews support programs that address common problems on three Linux architectures: x86, x86-64, and Linux Itanium. Learn how to execute bug fixes and lower the risk of applying patches.
Posted: 17 Dec 2008 | Published: 17 Dec 2008

Oracle Corporation

High Performance for Integrating Massive Data Volumes with Talend Integration Suite MP
sponsored by Talend
WHITE PAPER: Processing very large data sets provides unique constraints, especially when time windows available for this processing are shrinking. This paper presents a variety of technologies available to accelerate the processing of large data volumes, including massive parallelization, optimized data-set-mode processing, grid deployment, and load balancing.
Posted: 16 Mar 2010 | Published: 16 Mar 2010

Talend

SPARC T4 Servers – Optimized for End-to-End Data Center Computing
sponsored by Oracle Corporation
WHITE PAPER: Read this white paper to learn how Oracle’s SPARC T4 servers deliver new levels of end-to-end data center performance never before seen in the T-Series line of servers.
Posted: 11 Apr 2012 | Published: 11 Apr 2012

Oracle Corporation

Red Hat Enterprise Linux 6 on Next-Generation Servers
sponsored by Dell, Inc., Intel and Red Hat
WHITE PAPER: This white paper examines the defining reliability, availability, and serviceability characteristics of Red Hat Enterprise Linux. Learn how they enable the addition and removal of physical and logical devices while improving system availability and increasing capacity.
Posted: 27 Apr 2011 | Published: 26 Apr 2011

Dell, Inc., Intel and Red Hat

Oracle's SPARC T4-1, SPARC T4-2, SPARC T4-4, and SPARC T4-1B Server Architecture
sponsored by Oracle Corporation
WHITE PAPER: This white paper presents a combination of processors and servers that offer breakthrough performance and energy efficiency to help simplify data center infrastructure. Discover how your business can enjoy new levels of performance and scalability across a variety of workloads.
Posted: 28 Jun 2012 | Published: 25 Jun 2012

Oracle Corporation

Maximizing IT Value by Using High-End Server Processors
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Intel IT has standardized on Intel® Xeon® processors with a core frequency of 3 GHz for two-socket servers for design computing and enterprise server virtualization.
Posted: 24 Oct 2008 | Published: 23 Oct 2008

Dell, Inc. and Intel®

Intel® Xeon® Processor 5500 Series: An Intelligent Approach to IT Challenges
sponsored by Hewlett Packard Company and Intel
WHITE PAPER: As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with servers that deliver more performance and scalability, more efficiently. Read on to learn more.
Posted: 08 Jul 2009 | Published: 08 Jul 2009

Hewlett Packard Company and Intel
 
 
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