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FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Troubleshooting Fibre Channel Boot from SAN on the Cisco UCS B Series Chassis
sponsored by Global Knowledge
WHITE PAPER: This white paper discusses one component of Cisco's Unified Computing Solution: Stateless computing, which allows all the hardware settings of a server to be saved on a location outside the server itself, and is implemented through an XML-based software feature called a service profile.
Posted: 29 Sep 2014 | Published: 29 Sep 2014

Global Knowledge

Energy Efficient Cooling for Data Centers: A Close-Coupled Row Solution
sponsored by Schneider Electric
WHITE PAPER: The trend of increasing heat densities in data centers has held consistent with advances in computing technology for many years. As power density increased, it became evident that the degree of difficulty in cooling these higher power demand loads was also increasing.
Posted: 01 Oct 2010 | Published: 01 Oct 2010

Schneider Electric

PowerEdge C8000 Chassis
sponsored by Dell, Inc. and IntelĀ®
WHITE PAPER: This brief resource introduces the PowerEdge C8000 4U shared infrastructure chassis that can easily handle multiple workloads to help reduce response times while easing serviceability. Read on to learn more today.
Posted: 23 Jan 2014 | Published: 23 Jan 2014

Dell, Inc. and IntelĀ®

Power and Cooling Network Closets in the Healthcare Setting
sponsored by Emerson Network Power
WHITE PAPER: Network closets in the healthcare setting are housing more powerful and critical equipment as hospitals and ambulatory offices rely on these spaces to support an increasing number of business-critical applications such as electronic medical records (EMRs), wireless communications and digital imaging.
Posted: 07 Oct 2010 | Published: 07 Oct 2010

Emerson Network Power

Hot Aisle vs. Cold Aisle Containment
sponsored by APC by Schneider Electric
WHITE PAPER: This paper examines hot and cold air containment and highlights the reasons why hot aisle containment emerges as the preferred best practice.
Posted: 01 Oct 2010 | Published: 01 Oct 2010

APC by Schneider Electric

Increasing Data Center Efficiency by Using Improved High Density Power Distribution
sponsored by APC by Schneider Electric
WHITE PAPER: A new approach to power distribution for high density server installations saves floor space, simplifies power cabling, saves capital cost, reduces weight, and increases electrical efficiency. This paper describes this distribution architecture and quantifies the benefits.
Posted: 29 Apr 2009 | Published: 01 Jan 2006

APC by Schneider Electric

Choosing System Architecture and Cooling Fluid for High Heat Density Cooling Solutions
sponsored by Emerson Network Power
WHITE PAPER: High heat in critical spaces compromises availability. This paper discusses the pros and cons of different cooling fluids and system architectures, and explores the role of supplemental cooling technologies as data center densities increase.
Posted: 07 Jul 2009 | Published: 07 Jul 2009

Emerson Network Power

Emerson Network Power Rack PDU Solutions: Rack Power Distribution for Critical IT Equipment
sponsored by Emerson Network Power
WHITE PAPER: Today's successful businesses depend on adaptable technologies to help them respond quickly to market demands. Emerson Network Power's portfolio of products provide innovative, flexible solutions that ensure reliability and efficiency.
Posted: 22 Jan 2010 | Published: 22 Jan 2010

Emerson Network Power

Five Major Power Distribution Considerations for Data Center Racks
sponsored by Avocent
WHITE PAPER: Power densities and power consumption costs in data centers are rising. Learn what to consider when choosing the appropriate power distribution products at the rack level.
Posted: 11 Feb 2008 | Published: 01 Feb 2008

Avocent
 
 
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