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Packaging (of Electronic Components) White Papers (View All Report Types)
 
FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Failover Strategies on the Cisco UCS B Series Chassis
sponsored by Global Knowledge
WHITE PAPER: This white paper discusses how Cisco's popular and powerful Unified Computing Solution is driven by the flexibility and agility of the hardware failover options and Service Profiles.
Posted: 29 Sep 2014 | Published: 29 Sep 2014

Global Knowledge

PowerEdge C8000 Chassis
sponsored by Dell, Inc. and IntelĀ®
WHITE PAPER: This brief resource introduces the PowerEdge C8000 4U shared infrastructure chassis that can easily handle multiple workloads to help reduce response times while easing serviceability. Read on to learn more today.
Posted: 23 Jan 2014 | Published: 23 Jan 2014

Dell, Inc. and IntelĀ®

Increasing Data Center Efficiency by Using Improved High Density Power Distribution
sponsored by Schneider Electric
WHITE PAPER: A new approach to power distribution for high density server installations saves floor space, simplifies power cabling, saves capital cost, reduces weight, and increases electrical efficiency. This paper describes this distribution architecture and quantifies the benefits.
Posted: 29 Apr 2009 | Published: 01 Jan 2006

Schneider Electric

Operations Energy Management: From Data Center through Facilities
sponsored by CA Technologies.
WHITE PAPER: Rising energy costs are driving IT and facilities managers alike in all types of organizations to come up with new and innovative ways to reduce the amount of energy used to power and cool the data center.
Posted: 10 Dec 2008 | Published: 13 Oct 2008

CA Technologies.

Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by Schneider Electric
WHITE PAPER: This paper discusses new piping approaches, which can dramatically reduce the risk of leakage and facilitate high-density deployment.
Posted: 21 Nov 2008 | Published: 20 Nov 2008

Schneider Electric

Standardization and Modularity in Network-Critical Physical Infrastructure
sponsored by Schneider Electric
WHITE PAPER: Standardization and its close relative, modularity, create wide-ranging benefits in NCPI that streamline and simplify every process from initial planning to daily operation.
Posted: 04 Feb 2009 | Published: 04 Feb 2009

Schneider Electric

Creating Order from Chaos in Data Centers and Server Rooms
sponsored by Schneider Electric
WHITE PAPER: Data center professionals can rid themselves of messy racks, sub-standard under floor air distribution, and cable sprawl with a minimum of heartache and expense. This paper outlines several innovative approaches for dealing with the symptoms of chaos and for eliminating the root causes of disorder.
Posted: 04 Feb 2009 | Published: 03 Feb 2009

Schneider Electric

Top 5 Questions to Ask About Your 10GbE Data Center
sponsored by Juniper Networks, Inc.
WHITE PAPER: Before making the jump to a 10 Gigabit Ethernet data center network, there are five questions you should ask yourself. View this whitepaper to learn what they are!
Posted: 17 Apr 2013 | Published: 28 Sep 2012

Juniper Networks, Inc.

Choosing System Architecture and Cooling Fluid for High Heat Density Cooling Solutions
sponsored by Emerson Network Power
WHITE PAPER: High heat in critical spaces compromises availability. This paper discusses the pros and cons of different cooling fluids and system architectures, and explores the role of supplemental cooling technologies as data center densities increase.
Posted: 07 Jul 2009 | Published: 07 Jul 2009

Emerson Network Power
 
 
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