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Object Linking and Embedding

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Object Linking and Embedding White Papers (View All Report Types)
 
Systematic Development and the Service Oriented Architecture
sponsored by Sun Microsystems, Inc.
WHITE PAPER: One of the ongoing challenges in IT is managing the cost, time, and risk associated with application development. Learn how to improve SOA and application development, by incorporating a methodology, governance model and architecture.
Posted: 22 Nov 2006 | Published: 01 May 2006

Sun Microsystems, Inc.

Open Trusted Technology Provider Standard (O-TTPS)
sponsored by ComputerWeekly.com
WHITE PAPER: This standard is aimed at enhancing the integrity of commercial off the shelf ICT products and helping customers to manage sourcing risk.
Posted: 10 Apr 2013 | Published: 10 Apr 2013

ComputerWeekly.com

Oracle Cloud’s Platform as a Service: Innovate, Integrate, and Collaborate
sponsored by Oracle Corporation
WHITE PAPER: Platform as a service (PaaS), cloud-based platforms for developing and deploying applications, can eliminate the complexity of managing the database, middleware, and infrastructure Access this white paper to learn about one specific PaaS solution.
Posted: 16 Feb 2015 | Published: 31 Jan 2015

Oracle Corporation

Strategic Migration Planning Guide: Weblogic to JBoss Enterprise Application Platform
sponsored by Red Hat
WHITE PAPER: Read about the proven five-step process designed to identify migration opportunities, examine the risks associated with various migration scenarios, create a standard enterprise environment, and develop a comprehensive and strategic migration plan to the JBoss Enterprise Application Platform.
Posted: 28 Jul 2015 | Published: 30 Sep 2014

Red Hat

SOA Platforms - Evolving to Meet Stringent Market Realities
sponsored by Fiorano Software, Inc.
WHITE PAPER: This white paper details the evolution of SOA platforms from point products to second-generation architectures such as the enterprise service grid.
Posted: 13 Jun 2007 | Published: 01 Jun 2007

Fiorano Software, Inc.

Guidelines for Specification of Data Center Power Density
sponsored by Schneider Electric
WHITE PAPER: Specifying data center density has yet to conform to an established standard within the industry. This paper describes the science and practical application of an improved method for the specification of power and cooling infrastructure for data centers.
Posted: 30 Oct 2006 | Published: 01 Jan 2005

Schneider Electric

IEEE 1149.1 Use in Design for Verification and Testability at Texas Instruments
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document introduces those products that include ASIC cells, standard interface ICs, a bus master IC, a controller interface board for IBM compatibles, a high-speed scan interface, and software to control the scan bus.
Posted: 17 Mar 2002 | Published: 05 May 2000

Texas Instruments, Inc.

Demystifying IT Network Cabling Specifications from 5e to 7A
sponsored by Siemon Company
WHITE PAPER: This paper discusses the current state of copper-based network cabling standards as defined by ISO and TIA. Learn the difference between category 5e, 6, 6A, 7 and 7A and Class D, E, EA, F and FA.
Posted: 20 Aug 2007 | Published: 01 Aug 2007

Siemon Company

Cisco and Standards: Opening the Door to Borderless Networks
sponsored by Cisco Systems, Inc.
WHITE PAPER: This white paper details the need for standards adoption and adherence in order to reap the rewards in the following areas: Integration and testing, deployment, operations, problem resolution, availability, security, accessibility, open systems, cost savings, and choice.
Posted: 01 Dec 2010 | Published: 30 Nov 2010

Cisco Systems, Inc.

Facilitating “sound practices” in risk management with IBM OpenPages ORM
sponsored by IBM
WHITE PAPER: This white paper discusses operational risk management (ORM) in the context of "Sound Practices for the Management and Supervision of Operational Risk," a paper from the Basel Committee.
Posted: 08 Feb 2012 | Published: 08 Feb 2012

IBM
 
 
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