IC Test Equipment White Papers

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Design-for-Test Analysis of a Buffered SDRAM DIMM
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document presents a design-for-test analysis of a buffered synchronous dynamic random access memory dual in-line memory module.
Posted: 11 Mar 2002 | Published: 13 Aug 1996

Texas Instruments, Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

IEEE 1149.1 Use in Design for Verification and Testability at Texas Instruments
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document introduces those products that include ASIC cells, standard interface ICs, a bus master IC, a controller interface board for IBM compatibles, a high-speed scan interface, and software to control the scan bus.
Posted: 17 Mar 2002 | Published: 05 May 2000

Texas Instruments, Inc.

Dell: Expanding Its Position as an HPC Market Leader
sponsored by Dell, Inc. and Intel®
WHITE PAPER: With several offerings available, choosing the ideal high performance computing (HPC) offering for your business can be a daunting task. This resource examines one well-reputed HPC vendor and explains how it differentiates itself in the competitive marketplace.
Posted: 02 Apr 2012 | Published: 01 Apr 2011

Dell, Inc. and Intel®

HP's latest management solution will help conquer data center challenges
sponsored by HPE and Intel®
WHITE PAPER: Take a look at this exclusive resource to find out how HP's new approach to infrastructure management can help you save time and money when confronting data center challenges.
Posted: 05 Feb 2014 | Published: 31 Oct 2013

HPE and Intel®

MAXIMIZE THE VALUE OF YOUR APPLICATIONS WITH FUSION MIDDLEWARE
sponsored by Oracle Corporation
WHITE PAPER: This white paper explores the challenges of operating multiple applications simultaneously. Find out how you can improve efficiency and reduce risk with a pre-integrated application infrastructure.
Posted: 02 Aug 2012 | Published: 01 Jun 2010

Oracle Corporation

WebSphere DataPower Integration Blade XI50B
sponsored by IBM
WHITE PAPER: Read this paper to learn about WebSphere DataPower Integration Blade XI50B, a specialized, high-performance hardware appliance that can empower you t improve competitiveness by helping to strengthen business connectivity with partners and customers, and between internal organizations, add specialized connectivity, integration and more.
Posted: 12 Apr 2012 | Published: 12 Apr 2012

IBM

HP CarePack Services Defined
sponsored by Insight and HP
WHITE PAPER: HP Care Pack Services are support packages that expand and extend standard warranties for HP hardware and software. HP Care Pack Services provide hardware and software support, installation services, education services and premium support options to meet the needs of business-critical IT environments. View this data sheet to learn more.
Posted: 03 Mar 2014 | Published: 31 Dec 2012

Insight and HP

Reduce data center complexity when you 'go virtual'
sponsored by HPE and Intel®
WHITE PAPER: Access this exclusive, in-depth resource to find out how HP's latest solution for virtual environments can benefit your organization.
Posted: 04 Mar 2014 | Published: 31 Dec 2013

HPE and Intel®

Cisco UCS C-Series Rack Servers for Microsoft Exchange 2010
sponsored by Insight
WHITE PAPER: Explore this solution brief to learn about an innovative rack server series specifically designed to help organizations deploy and effectively run Microsoft Exchange Server environments. Learn more about the advanced features and benefits of this hardware.
Posted: 22 Apr 2013 | Published: 22 Apr 2013

Insight