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IC Test Equipment White Papers (View All Report Types)
 
IEEE 1149.1 Use in Design for Verification and Testability at Texas Instruments
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document introduces those products that include ASIC cells, standard interface ICs, a bus master IC, a controller interface board for IBM compatibles, a high-speed scan interface, and software to control the scan bus.
Posted: 17 Mar 2002 | Published: 05 May 2000

Texas Instruments, Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Design-for-Test Analysis of a Buffered SDRAM DIMM
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document presents a design-for-test analysis of a buffered synchronous dynamic random access memory dual in-line memory module.
Posted: 11 Mar 2002 | Published: 13 Aug 1996

Texas Instruments, Inc.

Digital Printing: Deliver Speed and Quality Together
sponsored by TechData - HP
WHITE PAPER: Digital printing speed, quality, productivity, and cost – it shouldn't be a tradeoff where you have to sacrifice one for the other. This paper explores how to balance these key traits of printing hardware and apps. Discover how to implement a reliable, scalable printing strategy that delivers quality and speed together without driving up the costs.
Posted: 27 Jan 2017 | Published: 31 Jan 2016

TechData - HP

Oracle Enterprise Manager 12C
sponsored by Oracle Corporation
WHITE PAPER: Companies must adapt their management practices to provide proper control over resources in the cloud. This white paper showcases a management tool designed with these types of environments in mind and discusses its key features and benefits.
Posted: 05 Jul 2012 | Published: 01 Sep 2011

Oracle Corporation

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

What's New with Dell PowerEdge 12th Generation Servers?
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Take a look at this in-depth resource to find out what you need to know about the next generation servers and how you can successfully transition to this latest technology.
Posted: 19 Feb 2014 | Published: 31 May 2012

Dell, Inc. and Intel®

Deployment Framework Best Practices
sponsored by Red Hat and HP
WHITE PAPER: This white paper examines various Linux configuration and deployment options. Discover key installation considerations to take into account and obtain best practices to help you execute your implementation with ease.
Posted: 18 Jul 2012 | Published: 01 Mar 2012

Red Hat and HP

Reduce Federal Infrastructure Risk with Compliance Management and Situational Awareness
sponsored by IBM
WHITE PAPER: This white paper features holistic information and network security tools that help federal agencies meet strict compliance mandates.
Posted: 12 May 2014 | Published: 31 Jan 2014

IBM

HP's latest management solution will help conquer data center challenges
sponsored by HPE and Intel®
WHITE PAPER: Take a look at this exclusive resource to find out how HP's new approach to infrastructure management can help you save time and money when confronting data center challenges.
Posted: 05 Feb 2014 | Published: 31 Oct 2013

HPE and Intel®
 
 
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