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Heat Sinks

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DEFINITION: A material that absorbs heat. It is typically made of aluminum. Heat sinks are commonly used in amplifiers and other electronic devices that build up heat, and it is the most economical method for cooling a semiconductor device (chip).
Heat SinksWhite Papers (View All Report Types)
101 - 125 of 255 Matches Previous Page  | Next Page
Hardware Upgrades to Improve Database SharePoint, Exchange, and File Server Performance with the Dell Poweredge T630
sponsored by Dell, Inc. and Intel®
WHITE PAPER: You can have the hardware necessary to ensure your applications meet business workloads of today and those to come in the future with the Dell PowerEdge T630 Tower Server.
Posted: 06 Nov 2014 | Published: 17 Sep 2014

Dell, Inc. and Intel®

How to improve wellbeing and health of deskworkers
sponsored by MMD
WHITE PAPER: The following white paper explores the benefits of a uniquely interactive monitor that provides real-time insights to your employee's posture, alertness, head tilt, and more so they can correct unhealthy body positioning, ultimately increasing their well-being, happiness, and efficiency.
Posted: 14 Apr 2014 | Published: 14 Apr 2014

MMD

HP CarePack Services Defined
sponsored by Insight and HP
WHITE PAPER: HP Care Pack Services are support packages that expand and extend standard warranties for HP hardware and software. HP Care Pack Services provide hardware and software support, installation services, education services and premium support options to meet the needs of business-critical IT environments. View this data sheet to learn more.
Posted: 03 Mar 2014 | Published: 31 Dec 2012

Insight and HP

HP ServeIT for IT Infrastructure
sponsored by Hewlett-Packard Company
WHITE PAPER: View this white paper to discover the three preconfigured server solutions available to move your business forward offered by industry giants HP and Microsoft. Cut and slash mundane IT task times to open your days to innovation by choosing the ProLiant Gen 8 server sized right for you.
Posted: 20 Nov 2014 | Published: 29 Oct 2014

Hewlett-Packard Company

Hyper-V Virtual Labs Tips and Tricks
sponsored by Veeam Software
WHITE PAPER: Check out this exclusive resource to uncover a complete list of tips and tricks for virtual lab testing in a Hyper-V environment, so you can eliminate as many risks as possible.
Posted: 01 Apr 2014 | Published: 01 Apr 2014

Veeam Software

Guidance for Calculation of Efficiency (PUE) in Data Centres
sponsored by APC by Schneider Electric
WHITE PAPER: The efficiency ratings of a data centre can vary substantially depending on what methodologies are applied. Access this exclusive resource to discover the importance of measuring data centre efficiency and learn about the issues companies face when establishing the PUE of an infrastructure.
Posted: 09 Dec 2011 | Published: 09 Dec 2011

APC by Schneider Electric

Guidelines for Specification of Data Center Power Density
sponsored by APC by Schneider Electric
WHITE PAPER: Specifying data center density has yet to conform to an established standard within the industry. This paper describes the science and practical application of an improved method for the specification of power and cooling infrastructure for data centers.
Posted: 30 Oct 2006 | Published: 01 Jan 2005

APC by Schneider Electric

High Availability for SQL Server 2005 Using array-based Replication and Host-based Mirroring Technologies
sponsored by Hewlett-Packard Company
WHITE PAPER: This paper provides the data needed to understand the options and the limitations for implementing remote replication solutions on a clustered HP server and storage area network (SAN)-based storage infrastructure.
Posted: 12 Mar 2008 | Published: 01 Jan 2008

Hewlett-Packard Company

High Efficiency Indirect Air Economizer-based Cooling for Data Centers
sponsored by APC by Schneider Electric
WHITE PAPER: This white paper details how indirect air economizer-based cooling will lower the cost of running your data center without the same risk as directly exposing your infrastructure to the outdoor air.
Posted: 18 Nov 2013 | Published: 18 Nov 2013

APC by Schneider Electric

Hot Aisle vs. Cold Aisle Containment
sponsored by APC by Schneider Electric
WHITE PAPER: This paper examines hot and cold air containment and highlights the reasons why hot aisle containment emerges as the preferred best practice.
Posted: 01 Oct 2010 | Published: 01 Oct 2010

APC by Schneider Electric

How Monitoring Systems Reduce Human Error in Distributed Server Rooms and Remote Wiring Closets
sponsored by APC by Schneider Electric
WHITE PAPER: Surprise incidences of downtime in server rooms and remote wiring closets lead to sleepless nights for many IT managers. This paper analyzes several of these incidents and makes recommendations for how a basic monitoring system can help reduce the occurrence of these unanticipated events.
Posted: 26 Jan 2011 | Published: 26 Jan 2011

APC by Schneider Electric

How to Adapt to the Dynamics of the Virtual Workforce
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This exclusive paper takes an in-depth look at an integrated solution stack from Dell that enables desktop virtualization, from pilots to full scale deployments, as a complete data center solution.
Posted: 12 Jun 2013 | Published: 12 Jun 2013

Dell, Inc. and Intel®

How to Start a Windows Vista Pilot Deployment
sponsored by Microsoft
WHITE PAPER: Thinking about deploying Windows Vista? This guide gives an overview of how to successfully manage a pilot program that provides the best experience for pilot users and helps to provide positive project justification to business decision makers.
Posted: 26 Nov 2008 | Published: 26 Nov 2008

Microsoft

HP BladeSystem c-Class architecture
sponsored by Hewlett-Packard Company
WHITE PAPER: Discover how to manage the consequences of high density data centers with a technology that allows an administrator to maximize computing resources, improve flexibility and better manage power and cooling costs.
Posted: 29 Jun 2007 | Published: 01 Jun 2007

Hewlett-Packard Company

HP Data Center Smart Grid: An HP Converged Infrastructure Innovation Primer
sponsored by HP & Intel®
WHITE PAPER: By helping your data center more accurately visualize and control energy use, you'll reclaim facility capacity and optimize energy use en route to reducing costs for your organization. Read this white paper for the details.
Posted: 10 May 2011 | Published: 10 May 2011

HP & Intel®

HP Device Manager 4.5 User Guide
sponsored by Hewlett-Packard Company
WHITE PAPER: this comprehensive white paper gives insight into an innovative server-based application that provides powerful centralized administration capabilities for thin client devices running HP software
Posted: 19 Jul 2013 | Published: 30 Nov 2012

Hewlett-Packard Company

HP Networking Cisco Trade-in Program
sponsored by Computer Design & Integration LLC
WHITE PAPER: This paper discusses a trade-in program provided by HP to help you cost-effectively upgrade your infrastructure. Uncover which products are eligible and how to get started.
Posted: 10 May 2011 | Published: 10 May 2011

Computer Design & Integration LLC

HP Virtualization with Intel and VMware: End-to-end Virtualization of IT Resources
sponsored by VMware, Inc.
WHITE PAPER: This white paper explores a virtualization approach that easily enables you to consolidate IT resources, enhance disaster recovery capabilities, and more.
Posted: 19 Nov 2008 | Published: 18 Nov 2008

VMware, Inc.

HP's latest management solution will help conquer data center challenges
sponsored by HP and Intel
WHITE PAPER: Take a look at this exclusive resource to find out how HP's new approach to infrastructure management can help you save time and money when confronting data center challenges.
Posted: 05 Feb 2014 | Published: 31 Oct 2013

HP and Intel

Humidification Strategies for Data Centers and Network Rooms
sponsored by APC by Schneider Electric
WHITE PAPER: The control of humidity in Information Technology environments is essential to achieving high availability. This paper explains how humidity affects equipment and why humidity control is required.
Posted: 10 Jul 2009 | Published: 01 Feb 2005

APC by Schneider Electric

IBM BladeCenter vs. HP BladeSystem
sponsored by IBM
WHITE PAPER: This white paper explores the key server components that influence power consumption. Get detailed guidance on data center planning, architecture, server implementation, and management so you can ensure maximum performance and power utilization.
Posted: 09 Aug 2011 | Published: 01 May 2010

IBM

IBM Inspires Customer Delight by Consistently Meeting High Customer Expectations for Product and Service Integrity
sponsored by IBM and Intel
WHITE PAPER: In Technology Business Research’s 3Q10 x86-based Server Customer Satisfaction Study, based on the views of 481 IT decision-makers in North America, IBM earned its fifth straight No. 1 ranking and its fourth consecutive singular (unshared) top ranking. Read this retrospective analysis to learn more.
Posted: 07 Jun 2011 | Published: 07 Jun 2011

IBM and Intel

IBM PureFlex Systems with VMWare: Cloud-ready virtualization with the flexibility of an expert integrated system
sponsored by IBM
WHITE PAPER: This resource explores the benefits of combining IBM PureFlex System with VMware. Inside, discover how you can implement a reliable cloud-ready infrastructure with integrated hardware and software designed for efficient virtualization. Discover if this combination will bring the benefits your organization needs.
Posted: 15 Jul 2013 | Published: 30 Apr 2012

IBM

IBM System x Servers - The Right Choice. Open. Easy. Green
sponsored by IBM
WHITE PAPER: IBMSystemx is a portfolio of robust servers built on IBMX-Architecture's our blueprint for bringing innovation tox86systems. Innovation that helps set you apart from the competition. Learn more in this paper.
Posted: 11 Sep 2008 | Published: 11 Sep 2008

IBM

IBM System x3650 M4 Servers Data Sheet
sponsored by IBM and Intel.
WHITE PAPER: Explore this datasheet to learn about a scalable server package that can save your enterprise money without sacrificing speed or availability.
Posted: 07 Jul 2014 | Published: 14 Sep 2013

IBM and Intel.
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