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Distributed Component Object Model

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Distributed Component Object ModelWhite Papers (View All Report Types)
 
Guidelines for Specification of Data Center Power Density
sponsored by APC by Schneider Electric
WHITE PAPER: Specifying data center density has yet to conform to an established standard within the industry. This paper describes the science and practical application of an improved method for the specification of power and cooling infrastructure for data centers.
Posted: 30 Oct 2006 | Published: 01 Jan 2005

APC by Schneider Electric

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Cisco and Standards: Opening the Door to Borderless Networks
sponsored by Cisco Systems, Inc.
WHITE PAPER: This white paper details the need for standards adoption and adherence in order to reap the rewards in the following areas: Integration and testing, deployment, operations, problem resolution, availability, security, accessibility, open systems, cost savings, and choice.
Posted: 01 Dec 2010 | Published: 30 Nov 2010

Cisco Systems, Inc.

One Click Away: Where Does the Data Come From?
sponsored by LANSA
WHITE PAPER: Thirty-five percent of consumers say they would never use a mobile app again if it contained incorrect product data. This brief resource explores how the global standards body GS1 established the Global Data Synchronization Network (GDSN) as a means of combatting outdated, inconsistent product information.
Posted: 20 Feb 2014 | Published: 20 Feb 2014

LANSA

Demystifying IT Network Cabling Specifications from 5e to 7A
sponsored by Siemon Company
WHITE PAPER: This paper discusses the current state of copper-based network cabling standards as defined by ISO and TIA. Learn the difference between category 5e, 6, 6A, 7 and 7A and Class D, E, EA, F and FA.
Posted: 20 Aug 2007 | Published: 01 Aug 2007

Siemon Company

SOA Best Practices: The BPEL Cookbook
sponsored by Oracle Corporation
WHITE PAPER: The Business Process Execution Language (BPEL) Cookbook highlights SOA best practices and challenges, detailing the importance of BPEL and other standards-based technologies in accelerating the adoption of an SOA.
Posted: 16 Mar 2009 | Published: 02 Aug 2007

Oracle Corporation

RFID Basics for Retailers
sponsored by Intermec
WHITE PAPER: This white paper illuminates RFID by providing an overview of RFID technology; describing the current status of relevant RFID standards initiatives; illustrating how RFID can be integrated to enhance existing wireless LAN, bar code and mobile computing systems; and providing guidance for selecting and planning RFID pilots and implementations.
Posted: 04 Mar 2009 | Published: 04 Mar 2009

Intermec

IEEE 1149.1 Use in Design for Verification and Testability at Texas Instruments
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document introduces those products that include ASIC cells, standard interface ICs, a bus master IC, a controller interface board for IBM compatibles, a high-speed scan interface, and software to control the scan bus.
Posted: 17 Mar 2002 | Published: 05 May 2000

Texas Instruments, Inc.

IFRS in the Life Sciences: Broad implications
sponsored by Deloitte
WHITE PAPER: This paper provides practical industry insights on IFRS for life science executives and includes useful sections on: IFRS challenges and opportunities in life sciences; Implications of IFRS for financial reporting, tax, human resources, mergers and acquisitions, IT, and treasury and much more.
Posted: 04 Sep 2009 | Published: 03 Sep 2009

Deloitte

ITIL Version 3.0 -- What It Means to You
sponsored by Global Knowledge
WHITE PAPER: As the IT industry standardizes its operations to solve business problems in the most efficient, effective, economical, and equitable way, ITIL v3 becomes a critical tool.
Posted: 06 Jul 2006 | Published: 01 Jul 2006

Global Knowledge
 
 
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