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Condensers White Papers (View All Report Types)
 
Improved Chilled Water Piping Distribution Methodology for Data Centers
sponsored by Schneider Electric
WHITE PAPER: This white paper details the issues involved with chilled water piping and offers flexible piping as a reliable solution.
Posted: 10 Oct 2013 | Published: 07 Oct 2011

Schneider Electric

Guidance for Calculation of Efficiency (PUE) in Data Centres
sponsored by Schneider Electric
WHITE PAPER: The efficiency ratings of a data centre can vary substantially depending on what methodologies are applied. Access this exclusive resource to discover the importance of measuring data centre efficiency and learn about the issues companies face when establishing the PUE of an infrastructure.
Posted: 09 Dec 2011 | Published: 09 Dec 2011

Schneider Electric

Emerson Network Power Rack PDU Solutions: Rack Power Distribution for Critical IT Equipment
sponsored by Emerson Network Power
WHITE PAPER: Today's successful businesses depend on adaptable technologies to help them respond quickly to market demands. Emerson Network Power's portfolio of products provide innovative, flexible solutions that ensure reliability and efficiency.
Posted: 22 Jan 2010 | Published: 22 Jan 2010

Emerson Network Power

Optimizing Facility Operation in High Density Data Center Environments
sponsored by Hewlett Packard Enterprise
WHITE PAPER: This paper describes issues of high processor and server density within existing data center infrastructures. It identifies methods to optimize the effectiveness of power and cooling resources in facilities that are deploying high-density equipment...
Posted: 11 Jun 2008 | Published: 01 Aug 2007

Hewlett Packard Enterprise

HP BladeSystem c-Class architecture
sponsored by Hewlett Packard Enterprise
WHITE PAPER: Discover how to manage the consequences of high density data centers with a technology that allows an administrator to maximize computing resources, improve flexibility and better manage power and cooling costs.
Posted: 29 Jun 2007 | Published: 01 Jun 2007

Hewlett Packard Enterprise

Five Strategies for Cutting Data Center Energy Costs through Enhanced Cooling Efficiency
sponsored by Liebert Corporation
WHITE PAPER: The cooling system represents a significant opportunity for improving efficiency, in many cases, relatively simple and inexpensive changes, such as improving room sealing or installing blanking panels, can pay immediate dividends.
Posted: 20 Feb 2008 | Published: 01 Jan 2007

Liebert Corporation

IBM BladeCenter vs. HP BladeSystem
sponsored by IBM
WHITE PAPER: This white paper explores the key server components that influence power consumption. Get detailed guidance on data center planning, architecture, server implementation, and management so you can ensure maximum performance and power utilization.
Posted: 09 Aug 2011 | Published: 01 May 2010

IBM

Unified Physical Infrastructure (UPI) Strategies for Thermal Management
sponsored by Panduit
WHITE PAPER: This white paper demonstrates how air sealing grommets can be used to close raised floor cutout spaces and improve data center cooling efficiency. Solutions that achieve the highest level of sealing effectiveness support network uptime goals by contributing to maximum cooling efficiency and providing superior cable management.
Posted: 28 Jan 2010 | Published: 28 Jan 2010

Panduit

Two-Dimensional Computational Fluid Dynamics Analysis of Blanking Panel Solutions
sponsored by Upsite Technologies, Inc.
WHITE PAPER: This resource examines the effects of using blanking panels to manage air recirculation and air-intake temperatures within server cabinets. Discover how to use blanking panels to seal the open spaces between IT equipment and learn more about the importance of effective and conditioned airflow management in computer rooms.
Posted: 29 Nov 2011 | Published: 29 Nov 2011

Upsite Technologies, Inc.

Energy Efficient Cooling for Data Centers: A Close-Coupled Row Solution
sponsored by Schneider Electric
WHITE PAPER: The trend of increasing heat densities in data centers has held consistent with advances in computing technology for many years. As power density increased, it became evident that the degree of difficulty in cooling these higher power demand loads was also increasing.
Posted: 01 Oct 2010 | Published: 01 Oct 2010

Schneider Electric
 
 
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