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IDG Tech Dossier: Density makes the difference
sponsored by HP and Intel® Xeon® processors

Many IT pros find themselves conflicted between the need to meet enterprise demands of increased processing capacity for growing business-critical applications and trying to limit physical data center expansion. Luckily, by utilizing next-generation increased-density rack-and-blade servers, organizations can address growing demands for compute capacity while reducing costly and inefficient data center sprawl.  Find out more from this exclusive resource about how you can meet the demand for growing compute capacity within physical limitations.

To Learn about the HP Discover 2013 event in Las Vegas, click here: 

http://h30614.www3.hp.com/discover/home?jumpid=ex_r11754_go_discover

Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

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