Choosing System Architecture and Cooling Fluid for High Heat Density Cooling Solutions

Choosing System Architecture and Cooling Fluid for High Heat Density Cooling Solutions

Cover
According to a report by the American Society of Mechanical Engineers, by 2011, computer and communications rack heat loads are projected to reach 30 kW with heat load densities of more than 500 W/ft2. Because availability is so dependent on temperature control in critical spaces, it is vital to explore cooling fluid (water vs. refrigerant) and system architecture (open vs. closed) options, as well as supplemental cooling technologies for specific data center applications.

This paper walks IT and data center managers through increasing cooling efficiency through tactics like cable management and rack arrangement, and implementing supplemental cooling where appropriate. Reducing high heat densities in the data center can help to avoid problems like high soft error rates, erratic or unrepeatable information, and outright hardware failures.

Vendor:
Emerson Network Power
Posted:
07 Jul 2009
Published:
07 Jul 2009
Format:
PDF
Length:
14 Page(s)
Type:
White Paper
Language:
English
Already a Bitpipe member? Login here

Download this White Paper!

By submitting you agree to receive email from TechTarget and its partners. If you reside outside of the United States, you consent to having your personal data transferred to and processed in the United States. Privacy