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IDC: Next - Generation Power and Cooling for Blade Environments

Cover
The HP BladeSystem features three fundamental technologies:

  • HP Insight Software for infrastructure management
  • HP Virtual Connect for virtual I/O networking
  • HP Thermal Logic for power and cooling
These technologies play a central role in reducing overall data center operating expenses and improving flexibility and control of infrastructure resources. They also differentiate HP BladeSystem both from competitive blade offerings and from rack-optimized servers.

In this technical brief, IDC examines HP Thermal Logic, a holistic approach to improving power and cooling efficiency in the IT infrastructure, designed to help companies reduce energy consumption, reclaim unused data center capacity, and extend the life of their data center. It joins the IDC technical briefs Next-Generation Management Software for Blade Environments and Next-Generation Technology for Virtual I/O and Blade Servers, which focus on the operational and cost advantages of HP Insight Software and HP Virtual Connect, respectively.
Vendor:
Hewlett Packard Company and Intel
Posted:
06 Apr 2009
Published
01 Dec 2008
Format:
PDF
Length:
11 Page(s)
Type:
Analyst Report
Language:
English

This resource is no longer available.