IDC: Next - Generation Power and Cooling for Blade Environments
sponsored by Hewlett Packard Company and Intel

The HP BladeSystem features three fundamental technologies:

  • HP Insight Software for infrastructure management
  • HP Virtual Connect for virtual I/O networking
  • HP Thermal Logic for power and cooling
These technologies play a central role in reducing overall data center operating expenses and improving flexibility and control of infrastructure resources. They also differentiate HP BladeSystem both from competitive blade offerings and from rack-optimized servers.

In this technical brief, IDC examines HP Thermal Logic, a holistic approach to improving power and cooling efficiency in the IT infrastructure, designed to help companies reduce energy consumption, reclaim unused data center capacity, and extend the life of their data center. It joins the IDC technical briefs Next-Generation Management Software for Blade Environments and Next-Generation Technology for Virtual I/O and Blade Servers, which focus on the operational and cost advantages of HP Insight Software and HP Virtual Connect, respectively.
Available Resources from Hewlett Packard Company and Intel
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