Next-Generation Power and Cooling for Blade Environments

Next-Generation Power and Cooling for Blade Environments

Cover
In this technical brief, IDC examines HP Thermal Logic, a holistic approach to improving power and cooling efficiency in the IT infrastructure, designed to help companies reduce energy consumption, reclaim unused datacenter capacity, and extend the life of their datacenter. It joins the IDC technical briefs Next-Generation Management Software for Blade Environments and Next-Generation Technology for Virtual I/O and Blade Servers, which focus on the operational and cost advantages of HP Insight Software and HP Virtual Connect, respectively.
Vendor:
Hewlett-Packard Company
Posted:
03 Mar 2009
Published
03 Mar 2009
Format:
PDF
Length:
11 Page(s)
Type:
Technical Article
Language:
English
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