sponsored by Intel Corporation
Posted:  24 Jul 2008
Published:  15 May 2006
Format:  HTML
Length:  2  Page(s)
Type:  Product Overview
Language:  English
ABSTRACT:

Specific form factor requirements of the mobile thin and light platform limit the kinds of cooling solutions these platforms can have. As a result, individual components inside mobile platforms (such as system memory devices) can heat up. With increased memory speeds and capacities, we are now reaching the point where the memory thermals are starting to exceed the cooling capabilities of mobile systems. To ensure that the memory devices operate within their thermal limits, their case temperatures need to be monitored and memory accesses throttled if any memory device overheats. This paper discusses about the need for memory throttling and address two memory throttling techniques, implemented in platforms built on Intel® Centrino® Duo mobile technology. These techniques greatly improve the memory power/thermal management in a thermally constrained platform by maximizing performance while keeping the system within its thermal limits.




Authors

Jayesh Iyer
Intel Corporation

Corinne L. Hall
Intel Corporation

Jerry Shi
Intel Corporation

Yuchen Huang
Intel Corporation



BROWSE RELATED RESOURCES
Bandwidth Management | Business Intelligence | Cooling Capacity | DRAM | ERP | Processor Architectures

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