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Airflow Uniformity through Perforated Tiles in a Raised-Floor Data Center

Cover

Perforated tiles on a raised floor often deliver substantially more or less airflow than expected, resulting in inefficiencies and even equipment failure due to inadequate cooling. In this paper, the impact of data center design parameters on perforated tile airflow is quantified and methods of improving the uniformity are discussed. This paper was written jointly by APC and IBM for the ASME InterPACK2005 Conference, held July 17-22 in San Francisco, California, USA. It is taken directly from the conference proceedings in its original form.

Authors

James W. VanGilder APC Corporation Roger R. Schmidt IBM Corporation
Vendor:
APC by Schneider Electric
Posted:
01 Jun 2006
Published
01 Jan 2005
Format:
PDF
Length:
11 Page(s)
Type:
White Paper
Language:
English

This resource is no longer available.